GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

New initiative aims to improve packaging capabilities, equipment and processes in order to accelerate both gate model and annealing quantum processor development D-Wave Quantum Inc. (NYSE: QBTS) ...

D-Wave Quantum Inc. (NYSE: QBTS) ("D-Wave"), a leader in quantum computing systems, software, and services, today announced a new strategic development initiative focused on advanced cryogenic ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its ...

Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking ceremony ...

TEMPE, Ariz. & HSINCHU, Taiwan--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding ...

Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...