Fullerton, Calif. — Designed for the termination of high-speed applications, TT electronics BI Technologies Electronic Components Division's RoHS-compliant SCSI termination resistor network is aimed ...

With Moon Hyuk-soo, CEO of LG Innotek, promoted to president in the 2026 regular executive reshuffle, LG Innotek is still struggling to bear fruit in new businesses. Unlike Samsung Electro-Mechanics, ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...

Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025-- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary ...

Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...

LG Innotek, the electronic components corporations of LG Group, is seeing profitability improve as shipments of high-value camera modules for Apple's "iPhone 17 series" increase, and expectations for ...