Design-Reuse

Making connections: The pursuit of chiplet interconnect standardization

It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected,” Gordon Moore wrote in his famous article, Cramming more ...
Design-Reuse

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

SANTA ROSA, Calif. -- Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the ...
EDN

Design the best interconnect for your next RF or microwave circuit

Microwave designers have long been aware of the importance of proper interconnect design as a critical step to successful circuit performance. As a matter of fact, one of the distinguishing features ...
Business Wire

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The ...
Electronic Design

Overcome Challenges in Embedded Optical Interconnect Design

The emergence of IoT in cloud computing and the demand for 4G and 5G networks worldwide are driving increased usage of optical transceivers in a wide variety of applications: business, government, ...
Yahoo Finance

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

SANTA ROSA, Calif., February 17, 2026--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) ...
Semiconductor Engineering

Power Benefits Of Modular Interconnect Design Using Network-On-Chip Technology

A look at why interconnects based on modular network on chip (NoC) technology comsume less power than older bus- and crossbar-based interconnects. January 31st, 2013 - By: Various Writers The ...
Seeking Alpha

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

SANTA ROSA, Calif.--(BUSINESS WIRE)-- Keysight Technologies, Inc. (KEYS) (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The ...
EDN

Overcoming interconnect obstacles with co-packaged optics (CPO)

CPO integrates optical components directly into a package, replacing long copper traces with shorter connections.
Electronic Design

Don’t Do It: Design Your Own On-Chip Interconnect

It’s extremely difficult to create an interconnect for complex SoCs. Building an interconnect requires a huge budget and a lot of engineering talent. Purchasing interconnect IP gives a company a head ...
Nature

Electromigration in Copper Interconnects and Power Grid Networks

Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...
Morningstar

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect ...