A new 16-zone reflow oven configuration by Kurtz Ersa  is positioning itself as a high-performance option for electronics manufacturers seeking tighter ...

The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...