Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64x400 Gbps or 32x800 Gbps pluggable optical transceiver modules.