Many companies employ some kind of inspection to verify process steps within their surface-mount technology (SMT) lines. Because solder-paste volume is an important predictor of solder-joint quality ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Key Companies Covered in the 3D Solder Paste Inspection (SPI) System Market Research are MirTec Ltd, Pemtron, CyberOptics Corporation, Koh Young, PARMI Corp, Test Research, Inc (TRI), Vi TECHNOLOGY, ...

"Single Lane - SPC Statistical Process Control - Germany IDS 5.3M Pixel -Machine Customisation is available 3D SPI Specification: Model EKT-8060A Board Handling PCB ...

MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will unveil the new Dual-Mode MRS ...

GOEPEL electronic presented new test technologies at the SMT/Hybrid/Packaging show in Nuremberg last week. First, new PILOT 6 AOI software includes major enhancements. In addition, the new PILOT ...

What is first article inspection? At what points in the production process is first article inspection needed? What requirements are validated by the first article inspection process? The first boards ...

EMS companies who produce PCBA’s have been using stencils for decades, to apply solder paste to boards, but this traditional method may one day be a thing of the past. Adam Harsant, Director at ...