SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...

Triad’s newest via configurable array, VCA-12, packs 3,900 mixed-signal resources into a die that can easily fit into small SOIC and QFN packages for size and price sensitive applications. “It is ...

HILLSBORO, OR – APRIL 24, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of its low cost, low power MachXO2™ family of programmable logic ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

The quad flat no-leads (QFN) package is a low-cost, lead frame-based package that’s very common in the semiconductor industry. QFN packages have small footprints and adapt well to most silicon devices ...

One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and ...