New advanced interconnect PDKs pave the way for high density, energy efficient chip to chip integration.

To help designers experiment with these architectures, NanoIC has released the first versions of its fine‑pitch RDL and D2W ...

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored ...