Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

Generic test and repair approaches to embedded memory have hit their limit. Smaller feature sizes, such as 130 nm and 90 nm, have made it possible to embed multiple megabits of memory into a single ...

Optimized memory test and repair algorithms efficiently address new memory defects, including process variation faults and resistive faults, at 20 nanometers (nm) and below New hierarchical ...

The burgeoning electronic content in automobiles has allowed numerous innovations to help improve the safety and comfort of cars and at the same time optimize the overall cost of automobiles. This has ...