Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...
New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows. MONTREAL, March 11, 2026 /CNW/ - Maya HTT today announced the ...
Some of the important trends driving EV development are getting more than 200 miles out of a charge, pricing below $40,000, fast charging such as less than 30 minutes for an 80% charge, increasing ...
The level of difficulty in designing electro-technique devices has increased, owing to thermal stress. With the development of electric vehicles and electric aircraft, and to keep up with the recent ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...
Today’s complex SoCs are prone to thermal issues that can cause field failures. Here’s how thermal analysis can help you ferret out those hotspots. As the semiconductor industry traverses through the ...
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