IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it will launch the industry's smallest enhancement-mode[1] gallium nitride (GaN)[2] power transistors (X-GaN TM)** package.

Editor’s note: The following white paper is from an IMAPS conference in 2014 in San Diego presented by GaN Systems and AT&S. We were just granted permission to publish this paper. Large GaN ...