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半导体中名词“wafer”“chip”“die”的区别
wafer:晶圆,是指硅半导体集成电路制作所用的硅晶片,由于其形状为圆形。 chip:芯片,是半导体元件产品的统称。 die:裸片 ,是硅片中一个很小的单位,包括了设计完整的单个芯片以及芯片邻近水平和垂直方向上的部分划片槽区域。 wafer为晶圆,由纯硅(Si ...
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