(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...
With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...
Infineon Technologies (OTCQX:IFNNY) on Wednesday said it is looking to grab a share of the growing gallium nitride (GaN) market with the development of a new technology, that could help in bringing ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
GlobalData on MSN
Micron starts construction on $24bn wafer fab in Singapore
The new Singapore facility will create jobs and expand capacity to serve growing NAND and memory demand.
The 2nm wafer technology ramp-up can potentially accelerate revenues and gross margins even more than what was seen in the 3nm ramp-up. TSMC is capacity-constrained. Capex investments to alleviate ...
AZoM on MSN
Accumeasure™ capacitive wafer measurement tools reduce start-up costs for specialty fabs ...
Vitrek, a US-based leader in precision measurement instruments, today announced the expanded capabilities of its MTI Accumeasure Capacitance Technology.
PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
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