What changes from LPDDR5 and LPDDR5X to LPDDR6, and why those changes matter for AI systems that care about bandwidth ...

The third white paper in our series, “Building an AI Chip” delves into the critical aspects of ensuring robust security and ...

MBSE for multiphysics; traceability vs. tracking; UALink VIP; EM simulation; code migration; SOI.

High-speed data movement will be required in future vehicles, probably including optical, but challenges persist.

This research presents a new dual-gate design strategy that enables stable operation even in nanoscale channels,” said Jae ...

AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...

HBM4 deal; war's impact on supply chain; U.S. AI framework; GPU smuggling; restart of H200 processors for China; SK hynix's ...

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D ...

Liquid cooling is proving effective at cooling high-power chips, such as GPUs, but it’s creating thermal issues for other ...

Mentor, a Siemens Business, is a broad line EDA supplier. It provides a complete semiconductor design flow that includes simulation, emulation, place and route, verification, design for manufacturing, ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now ...

A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was ...