Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

A tiny low power module can reshape IoT connectivity enabling faster deployment longer battery life and seamless cloud integration across rapidly expanding ...

Leveraging IsoShield multichip packaging, TI’s isolated power modules deliver up to 3× the power density of discrete devices.

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules.

RFMW, a Division of Exponential Technology Group, Inc., a premier distributor of RF, microwave, and power management and ...

Half-bridge eGaN buck designs deliver high efficiency and flexibility, supporting next-generation aerospace systems ...

Many IoT (the Internet of Things) devices require a reliable secondary power backup. If the primary supply or battery is ...

Texas Instruments (TI) unveiled at the Applied Power Electronics Conference (APEC) 2026 isolated power modules that allow for ...

Infineon launches what it describes as the industry’s first quad‑phase power module featuring TLVR technology.

ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

The company’s new IsoShield technology can squeeze most of the building blocks of a bias power supply into the same package.