Earlier this month, Microchip Technology released its BZPACK mSiC power modules, engineered to exceed stringent HV-H3TRB reliability standards for demanding industrial and renewable energy ...

The company’s new IsoShield technology can squeeze most of the building blocks of a bias power supply into the same package.

Texas Instruments (TI) today unveiled new isolated power modules, helping enable increased power density, efficiency and ...

Designed to deliver fast, efficient ORing functionality in applications requiring power supply redundancy or parallel operation these new units support continuous operation at 60 A or 80 A and handle ...

Microchip Technology has announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High ...

TI’s new isolated power modules use IsoShield packaging to deliver higher power density, smaller footprints, and reinforced ...

New power-sector training modules added, including turbines and substations. LONDON, UNITED KINGDOM, March 23, 2026 ...

High-Temperature Adhesives Market For EV Power Modules To 2036: India Leads Growth NAMICS & Shin-Etsu Drive Innovation. EINPresswire/ -- The global High-Temperature Adhesives for SiC/GaN Power Module ...

Reliable power is driving the current opportunity in energy stocks.

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature ...

Quarter-cut technology represents a critical pathway toward higher efficiency, enhanced reliability, and improved lifecycle value in PV modules. Through strong R&D capabilities, precision ...

Half-bridge eGaN buck designs deliver high efficiency and flexibility, supporting next-generation aerospace systems ...