Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Abstract: The need for data protection in national critical information infrastructure units has become more and more urgent with the deepening of digital transformation. At present, the rapid ...

Maximus (NYSE: MMS), a leading provider of tech-enabled government services, today announced the launch of Accuracy AssistantTM by Maximus, a suite of offerings for state government programs, tailored ...